hg1088皇冠

Equipment performance

Adjustable transmission speed: 0.5-3m/minNormal operation speed: 2.5m/minCapacity: up to 4000 wafers/ H@20mmUp to 6800 Wafers/ H@20mmUp to 8000 Wafers/ H@20mmEffective utilization rate of equipment: ≥ 98%Etching depth range: 0.7 ~ 6 μ mFragment rate: ≤ 0.03% 

Silicon wafer specification

Silicon wafer thickness: ≥ 140 μ mSilicon wafer size: 156.75 * 156.75mm-212 * 212mm

transmission

Transmission type: 5 lane / 6 LaneShaft spacing: 50mm / 60mmMain drive shaft: 17mm, hexagonDrive roller: Φ 32mm 

direction

Working direction：Left→Right/ Right→Left（TBD）  

power supply

Power supply: AC380V 3Ph + PE + n 50Hz (TBD)Control power supply: DC 24VFull load power supply: 75ARecommended maximum fuse size: 100A

Installation requirements

Minimum ground bearing capacity: 75kg / ㎡Minimum workshop height: 3.5mClean room level: iso7 (10K class)Ambient temperature: 17 ℃＜ RT ＜ 30 ℃Maximum humidity: 70%