hg1088皇冠

Equipment performance

Adjustable transmission speed：0.5-3m/minNormal operating speed：2.5m/mincapacity： Up to 4000 Wafers/H@20mm           Up to 6800 Wafers/H@20mm           Up to 8000 Wafers/H@20mmEffective utilization rate of equipment：≥98%Etching depth range：3.5~4.5μmFragment rate：≤0.03% 

Silicon wafer specification

Silicon wafer thickness: ≥ 140 μ mSilicon wafer size: 156.75 * 156.75mm-212 * 212mm 

Equipment size 

Length * width * height: determine the size according to the model selection 

transmission

Transmission type: 5 lane / 6 LaneShaft spacing: 60mmMain drive shaft: 17mm, hexagonDrive roller: Φ 32mm 

direction

Working direction：Left→Right  / Right→Left（TBD） 

power supply

Power supply: AC380V 3Ph + PE + n 50Hz (TBD)Control power supply: DC 24VFull load power supply: 75ARecommended maximum fuse size: 100A 

Installation requirements

Minimum ground bearing capacity: 75kg / ㎡Minimum workshop height: 3.5mClean room level: iso7 (10K class)Ambient temperature: 17 ℃＜ RT ＜ 30 ℃Maximum humidity: 70%