hg1088皇冠

主要功能:

Equipment performance

Adjustable transmission speed: 0.5-3m/minNormal operation speed: 2.5m/minCapacity: up to 4000 / 6800 / 8000 wafers/ H@20mmEffective utilization rate of equipment: ≥ 98%Reflectivity: ≤ 16%Fragment rate: ≤ 0.03% 

Silicon wafer specification

Silicon wafer thickness: ≥ 140 μ mSilicon wafer size: 156.75 * 156.75mm-212 * 212mm 

Equipment size 

Length * width * height: 5060 * 2250 * 2120mmLength * width * height: 3710 * 2650 * 2120mmLength * width * height: 3810 * 3050 * 2200mmWorking width: 965mm / 1515mm / 1911mmTransmission height: 1000 ± 25mmModule material: PP, PVDF 

transmission

Transmission type: 5 lane / 8 Lane / 10 LaneShaft spacing: 50mm / 60mmMain drive shaft: 17mm, hexagonDrive roller: Φ 32mm 

direction

Working direction：Left→Right  / Right→Left（TBD） 

power supply

Power supply: AC380V 3Ph + PE + n 50Hz (TBD)Control power supply: DC 24VFull load power supply: 25A / 48ARecommended maximum fuse size: 48A / 63A 

Installation requirements

Minimum ground bearing capacity: 750KG / ㎡Minimum workshop height: 3.5mClean room level: iso7 (10K class)Ambient temperature: 17 ℃＜ RT ＜ 30 ℃Maximum humidity: 70%