hg1088皇冠

Equipment performance

Capacity: up to 9600 / 8000 / 10000 / 12000 Wafers / hourEffective utilization rate of equipment: ≥ 98%Fragment rate: ≤ 0.01% 

Silicon wafer specification

Silicon wafer thickness: ≥ 140 μ mSilicon wafer size: 156.75 * 156.75mm-212 * 212mmFlower basket type: low surface carrier (LSC) made by PVDFSpace between flower baskets: 4.1mmBasket capacity: 100-120 wafers

Manipulator system

Manipulator: 4 setsServo motor: 8 PCLift time: less than 5 sec

 

Equipment size

Length * width * height: 15998 * 2630 * 2574mmLength * width * height: 16200 * 3000 * 2574mmLength * width * height: 17730 * 3000 * 2574mmLength * width * height: 25560 * 2960 * 2574mm 

direction

Working direction：Left→Right  / Right→Left（TBD） 

power supply

Power supply: AC380V 3Ph + PE + n 50Hz (TBD)Control power supply: DC 24VFull load power supply: 230kw / 138kwRecommended maximum fuse size: 225A / 135a 

Installation requirements

Minimum ground bearing capacity: 750KG / ㎡Minimum workshop height: 3.5mClean room level: iso7 (10K class)Ambient temperature: 17 ℃＜ RT ＜ 30 ℃Maximum humidity: 70%